Morse Micro, dealing in Wi-Fi HaLow silicon solutions, announced the successful completion of its Series C funding round, raising AUD 88 million.
The round was led by MegaChips and saw participation from National Reconstruction Fund Corporation (NRFC), Blackbird, Main Sequence, Uniseed, Ray Stata, Malcolm and Lucy Turnbull, Startmate, and institutional investors including Hostplus, NGS, and UniSuper. This latest funding brings Morse Micro’s total capital raised to over AUD 290 million to date.
The new funding will enable Morse Micro to accelerate its global expansion, scale production of Wi-Fi HaLow chips, and drive the transition to IoT 2.0—marking a new era of high-throughput, long-range, and highly scalable connectivity for IoT devices.
Michael De Nil, CEO and Co-founder of Morse Micro, said,
“This funding is another strong vote of confidence in our mission to be the number one wireless IoT chip company in the world. The future of IoT depends on connectivity that is long-range, power-efficient, secure and delivers on throughput – and that’s exactly where we’re leading. With this raise, we are accelerating our expansion and preparing for the next phase of our company’s growth.”
The funding arrives amid strong momentum for Morse Micro and Australia’s semiconductor sector. This week, the company unveiled HaLowLink 2, its next-generation global evaluation platform.
Earlier this year, it launched its second-generation System-on-Chip (SoC), expanded ecosystem partnerships, introduced new reference designs, and achieved mass production with leading OEMs. These accomplishments highlight Morse Micro’s pivotal role in advancing IoT from proof-of-concept to large-scale industrial and consumer deployment.